A full solution for coating semiconductor wafers with uniform thin films of photoresist in applications where traditional high speed spin coating cannot provide uniform coverage of deep well topographies or high aspect ratios such as MEMS. Designed for 100, 150, 200, and 300mm (option) semiconductor wafer processing.
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SPT200 openSPT200 side viewSPT200 close upSPT200 Ultrasonic Photoresist Coating System
Basic Specifications
| DIMENSIONS: 1066mm W x 1765 mm H x 1095 mm D (42” W x 70” H x 43” D) |
| WORK AREA: 465 mm x 465 mm x 100 mm (19.7” x 19.7” x 3.9”) |
| CONTROL: Windows-based (pc included 19-inch touch screen interface) |
| POWER REQUIREMENTS: 208-240VACc, 16A max, 50/60 Hz 1 phase (L,N,G) or (L1, L2, G) |
| AIR: 551.6 kPa (80PSI) 1 compressed air, 1 nitrogen |
| MOTORS: Brushless DC Servo |
| CERTIFICATION: CE |
| ULTRASONIC NOZZLE DESIGNS: Vortex, AccuMist, Impact |